MediaTek Dimensity 7050: Another Efficient Chipset!
Fast Speeds, Smoother Games: The octa-core CPU has two 2.6GHz Arm Cortex-A78 processors for outstanding performance, quick app response, and better frame rates in games. Longer gaming sessions are possible thanks to the Arm Mali-G68 GPU’s remarkable power-efficiency and optimisation for smooth, everyday gaming.
200MP Photos & 4K HDR Video: With support for 200MP main cameras, many hardware-based camera engines, and top-notch noise reduction algorithms built into the chip, you may take pictures that are bigger, brighter, and sharper. Take advantage of the specialised 4K HDR video capture engine to record and transmit video that is clear and brilliant under any lighting scenario. Users may activate AI-camera features like soft backdrop (AI-bokeh) in video and selective focus from a single camera, which is perfect for vlogs and streams, using the powerful MediaTek APU 550.
MediaTek HyperEngine: Brands can take use of MediaTek Intelligent Refresh Rate Display technology by including Full HD+ screens up to 120Hz into their smartphone designs to deliver all the advantages of ultrafast refresh rate displays while also maximising power economy.
Wi-Fi 6: Internet connections are faster and more dependable with Wi-Fi 6 and 2x2 MIMO. The Bluetooth 5 and GNSS are included into the chip, making the wireless connectivity more power-efficient than alternatives that require an additional chip.
Fast & Efficient 5G: Smartphones may combine low and mid-band advantages for faster speeds and a wider coverage area using 2CC-CA’s mixed duplex FDD+TDD. In a coverage layer, 5G-CA allows for faster average speeds and a seamless transition between two 5G connection zones. As a result, customers experience over 30% more throughput layer coverage than they would without CA.
The Dimensity 7050 is strengthened with even more 5G power-saving innovations thanks to MediaTek 5G UltraSave and the innovative 5G modem that is fully incorporated into this super-efficient, 6nm processor.
Dual 5G SIM (SA+SA) with support for premium VoNR voice and video call services from both connections gives users more options.
Extremely Power-Efficient 6nm Chip: Even for demanding users, battery life is increased by using the cutting-edge TSMC N6 (6nm-class) chip fabrication process. Device manufacturers may produce stunning, thin, and light 5G smartphones with outstanding performance and extended battery life because to its very power-efficient design.
The Dimensity 7050 has a powerful octa-core CPU with two 2.6GHz Arm Cortex-A78 processors, 200MP photos and 4K HDR video, MediaTek HyperEngine, Wi-Fi 6 and 2x2 MIMO, Fast & Efficient 5G, MediaTek 5G UltraSave, Dual 5G SIM (SA+SA) with support for premium VoNR voice and video call services, and TSMC N6 (6nm-class) chip fabrication process. These features provide users with fast speeds, smoother games, 200MP photos and 4K HDR video, MediaTek HyperEngine, Wi-Fi 6 and 2x2 MIMO, Fast & Efficient 5G, MediaTek 5G UltraSave, Dual 5G SIM (SA+SA) with support for premium VoNR voice and video call services, and TSMC N6 (6nm-class) chip fabrication process.