MediaTek Dimensity 8300: Redefining Midrange Smartphone Performance
MediaTek has officially launched the Dimensity 8300, a new upper-mid-range SoC for high-end phones, offering significant improvements over its predecessor, the Dimensity 8200. The chipset is built on TSMC’s “second generation” 4 nm process node, offering a tri-cluster CPU with one Cortex-A715 CPU at 3.35 GHz, three Cortex-A715 cores at 3.2 GHz, and four Cortex-A510 cores at 2.2 GHz.
The Dimensity 8300 boasts a 60% performance uplift over its predecessor with a 55% power efficiency improvement. It features an Arm Mali-G615 MC6 GPU clocked at 1,400 MHz, providing a 60% performance uplift over its predecessor with a 55% power efficiency improvement. The chipset also includes a 780 APU that is 3.3x faster than its predecessor and can run large-language models with up to 10 billion parameters natively. The new 14-bit HDR-ISP Imagiq 980 ISP can capture 4K 60 FPS HDR videos and leverage the onboard NPU for noise reduction, bokeh, and other tasks. The Dimensity 8300’s ISP can handle one 320 MP camera sensor or three 32 MP lenses simultaneously.
In terms of connectivity, the Dimensity 8300 supports SA and NSA networks, Wi-Fi 6E, and Bluetooth. It also offers support for high-speed LPDDR5X 8533 memory and UFS 4.0 storage. The chipset is designed to support generative AI, with a 7th Gen APU 780 processor and UFS 4.0 capability to accommodate generative AI needs. The Dimensity 8300’s GPU performance is impressive, scoring 9,112 points in the Geekbench’s OpenCL benchmark, over twice as fast as the Adreno 725 found on the Snapdragon 7+ Gen 2.
The Dimensity 8300 is expected to power upcoming midrange phones, with the Redmi K70 series smartphone being one of the first devices to debut with the Dimensity 8300 Ultra later this year, followed by other devices. The chipset is set to bring significant improvements to midrange phones, offering a 20% increase in peak performance at a 30% lower power rating than its predecessor, the Dimensity 8200. The first wave of phones powered by the Dimensity 8300 is expected to arrive by the end of 2023.
In conclusion, the MediaTek Dimensity 8300 offers a compelling package of performance, power efficiency, and AI capabilities, making it a promising choice for upcoming midrange smartphones. With its impressive GPU performance, support for generative AI, and advancements in connectivity and imaging, the Dimensity 8300 is set to bring significant improvements to the midrange smartphone segment.